³Ì ·s ®ø ®§

2019/12/16-¥xÆW¥b¾ÉÅé¬ã¨s¤¤¤ß©`¦Ì¶q´ú¹êÅç«Ç¨ú±oISO/IEC 17025:2017ª©TAF¹êÅç«Ç»{ÃÒÃÒ®Ñ
°ê®a¹êÅç¬ã¨s°|¥xÆW¥b¾ÉÅé¬ã¨s¤¤¤ß(Taiwan Semiconductor Research Institute, TSRI)«e¨­¬°¡u°ê®a´¹¤ù¨t²Î³]­p¤¤¤ß(National Chip Implementation Center, CIC)¡v»P¡u°ê®a©`¦Ì¤¸¥ó¹êÅç«Ç(National Nano Device Laboratories, NDL)¡v¨â³æ¦ì¡C©ó2019¦~¤¸¤ë°_¾ã¨Ö¡A¥H´Á¥´³y°ê»Ú¤@¬y¾Ç³N»P³Ð·s¬ì§Þ¬ãµo¿Ä¦Xªº¥b¾ÉÅé¾ã¦X¬ã¨sÀô¹Ò¡Aºûô¥xÆW¥b¾ÉÅéÄvª§¤O¡C

¥xÆW¥b¾ÉÅé¬ã¨s¤¤¤ß©`¦Ì¶q´ú¹êÅç«Ç©e°U«Â³Ç¥øºÞ»²¾ÉISO/IEC 17025:2017ª©TAF¹êÅç«Ç»{Â઩»²¾É¡A©ó2019/12/16¨ú±oISO/IEC 17025:2017ª©ÃҮѡA¥»¤½¥q»²¾ÉISO17025§ïª©¹êÁZ¡A²`¨ü¦U¬ÉªÖ©w¡C

ÂsÄý¤H¦¸¡G1412050